Automation Inside MarketPlace

07-08-2017

ARBOR Introduces The EmETXe-i90M0 COM Express Basic Type 6 module with 7th Generation Intel® Core™ Processor

ARBOR Technology Corp. (Taiwan) – ARBOR Technology, a leading provider of embedded computing solutions, announces the release of the ARBOR EmETXe-i90M...

30-05-2017

DFI Tech Announces New 7th Generation Intel Atom SoC Motherboards

DFI Tech (USA) – DFI Tech, a provider of embedded computing solutions and board products, has released new motherboards using the latest generation lo...

10-05-2017

Pixus Offers New Development Embedded Chassis Platform with Removable Sidewalls

Pixus Technologies (Canada) - Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers a development enclosure for 3U,...

09-03-2017

VIA to Debut VIA VTS-8589 OPS Board at Embedded World 2017

VIA Technologies, Inc. (Taiwan) – VIA Technologies, Inc., announced the it will debut its new VIA VTS-8589 OPS board at the 2017 Embedded World Exhibi...

09-03-2017

NEXCOM EBC 357X Series of 3.5” Boards Elevates Processing Power in Human-Machine Interfaces

NEXCOM International Co., Ltd. (Taiwan) – NEXCOM’s EBC 357X series of 3.5” boards improves processing power and enhances display performance in a reli...

08-02-2017

DFI Tech Offers i.MX6 SoC Version of Qseven Modules

DFI Tech (USA) – DFI Tech, a provider of embedded computing solutions and board products, now offers a 1-4 core i.MX6 NXP (formerly Freescale) version...