Embedded PC
SECO Launches PHOENIX and PYXIS, Two New Fanless Computer Solutions
SECO S.p.A. (Italy) - SECO, Gold Member of the Intel® Partner Alliance, expands its lineup of cutting-edge computing solutions based on Intel®...
DFI New-Gen ADS Series Embedded Computing Solutions for Intelligent Workload Optimization
DFI (Taiwan) - DFI is releasing the new ADS Series of embedded computing solutions powered by the 12th Gen Intel® Core™ SoC processors. T...
AMD Ryzen based congatec COM Express module for the industrial temperature
Congatec (Germany) - congatec – a leading vendor of embedded computing technology – introduces its new conga-TR4 COM Express Type 6 module...
ADLINK Accelerates Edge AI and Computing Deployment with Next Generation Matrix Embedded Computers
ADLINK Technology (Taiwan) - The new Matrix series combines CPU and GPU computing to enhance time to decision and performance at the edge. ADLINK T...
The Next Level of Fanless Systems by NEXCOM
NEXCOM International (Taiwan) - Press Release: In NEXCOM's quest to continually update computing solutions to reflect your needs, NISE 4300 is the...
Pixus Now Offers All-Metal Slim Handles for OpenVPX Boards
Pixus Technologies (Canada) - Pixus Technologies, a provider of embedded computing and enclosure solutions, has announced new handles for OpenVPX or c...